Semiconductor Packaging module
Learn more about integrated chip technology and its applications with focus on the design and manufacturing of semiconductor packages and the associated assembly techniques.
In the Semiconductor Packaging module you will get acquainted with the semiconductor industry and delve into the final step of chip manufacturing, the phase in which the chip is ‘packaged’ in its housing. Packaging is becoming more and more involved. Developments such as system-on-chip, embedded cameras, RF, sensors and Micro Electro Mechanical Systems (MEMS) place high demands on the manufacturing process and the competencies of affected employees. Packages are becoming more complex and more customer-specific, while their serial size decreases. This module focuses on the design and manufacturing of semiconductor packages and the associated assembly techniques. The module was developed through collaboration between HAN University of Applied Sciences, CITC and its partners NXP, Nexperia, Ampleon, TU Delft and TNO.
Read more in the Semiconductor Packaging University Program brochure.
Interested in joining this course that starts in September 2020? Please contact HAN and let us know or have a look at the HAN website.
